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diy die cutting

Posted: Fri Apr 25, 2014 9:24 am
by Dtrain
A while back we did a die cut base. letters where plyable after the skis cooled down. turned out the base was 1.6mm and the letters 1.3mm.

do any of think the thickness difference could of caused for bad pressure distribution to the letters.

I figured the epoxyy would bonded it well, even if it had less pressure in the cuttouts?

Posted: Fri Apr 25, 2014 10:04 am
by knightsofnii
yes, i think if the difference is big enough it would make enough void to compromise the bond.

And/or, the lack of pressure effected how much heat the lettering saw vs. the rest of the board, which may have transferred deep within

Posted: Fri Apr 25, 2014 12:05 pm
by gozaimaas
If I used a thinner material I would build it up with vinyl sticker material until it was the same thickness.
Saying that .3mm isnt much, I would expect it to stick but be a little bit uneven. Not sticking at all sounds more like a seperate bonding issue.